Silicon Packaging Design Engineer job opportunity at Altera Corporation.



DatePosted 6 Days Ago bot
Altera Corporation Silicon Packaging Design Engineer
Experience: General
Pattern: full-time
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loacation Penang 15, Penang, Malaysia, Malaysia
loacation Penang 15, Pen..........Malaysia

Job Details: Job Description: Develop next generation package solution from concept till tape-out. Ensure the package solution meets requirement for quality, performance, and cost. Manage multiple designs concurrently, working with multi-disciplinary teams. Leading the package design efforts for the development of pin map/ball map, in collaboration with the Package Architect, Design Lead, Power Integrity, and Signal Integrity engineers. Perform package design work such as package size fit assessment, package stack-up study, design rule to HVM, package signal and integrity requirement. Optimize package layout include ball map/bump map, stack-up and design methodology. Driving the substrate physical design reviews as per plan, and meet the schedule and quality expectations. Validating the design using design validation tools. Ensuring timely release/tape out of cost optimal high quality package substrates, after reviews with internal stakeholders and with the package substrate manufacturing vendors. Perform package design work per business process from layout till documentation. Manage package design related issue and highlight to design lead. Follow up closely to close the design issue. Identifying areas for improvement, for example: design tool features, design efficiency, design methods, and proactively seeking to partner with experts/teammates to drive the improvements. Innovative solutions for continuous improvement in efficiency and throughput. Providing inputs to the substrate and package assembly technology development teams to enable development of industry-leading designs.   Qualifications: BSEE/MS in Electrical/Electronic Engineering.   Familiarity in Design tool experience i.e. Mentor, Cadence, AutoCAD, Zukens, PADs, Altium or layout ECAD tools.   Familiarity in package design/PCB design would be an added advantage.   Knowledge of signal integrity and power integrity basics are must.   Good verbal and written skills.   A team player, highly motivated, self-directed, and should be able to work effectively, both independently and with other team members.   Job Type: Regular Shift: Shift 1 (Malaysia) Primary Location: Penang 15, Penang, Malaysia Additional Locations: Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

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