Senior Principal AI Interconnect Architect job opportunity at SanDisk.



Date2026-03-27T11:00:14.329Z bot
SanDisk Senior Principal AI Interconnect Architect
Experience: General
Pattern: Full-time
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degreeHigh School (S.S.C.E)
loacation Milpitas, California, United States Of America
loacation Milpitas, Cali..........United States Of America
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Job DescriptionAn AI Interconnect Architect defines and engineers high-speed networking and communication systems for AI Inference infrastructure which include servers, racks, and chips with a focus on bandwidth, power efficiency, scalability, and optimized transport protocols. Design solutions should take into account interconnect technologies such as PCIe, CXL, co-packaged optics, UALink, Ultra Ethernet, and be able to specify innovative scale-out architectures for optimizing power, cost, and performance. Essential Duties and Responsibilities: System Architecture & Design: Develop architectures for chip-to-chip interconnects and switched fabrics tailored for AI/ML scale-out. Performance Optimization: Analyze trade-offs in bandwidth, latency, power, area, and reliability. Technology development and standards: Participate in industry standard bodies and contribute/influence/shape the direction of industry specifications.Cross-functional Collaboration: Work with SoC, package design, and software teams to ensure seamless integration

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